Applications for registration shall be made only on forms issued by the board. No applications made otherwise than on such form will be accepted by the board. In the event that forms issued by the board do not contain sufficient space for evidence to be submitted, the applicant may attach additional sheets to said form to any extent desired by applicant, but such attached sheets shall for convenience of filing be of the same size as the forms and shall be securely attached thereto.
The board requires an official transcript of degrees subsequent to high school. It is the duty of the applicant to see that such a record is enclosed with application when submitted, since no action will be taken by the board until such information is received.
All foreign language documentation submitted with the completed application must be accompanied by certified English translations. The translation report shall be sent directly from the translator to the board for review.
Those applicants who, for political or other valid reasons, are unable to obtain their college transcripts shall be processed on a case-by-case basis by the board.
The board may require an independent evaluation of the engineering education of an applicant who was educated outside the United States or has graduated from an unaccredited engineering program. Such evaluation shall be done through an organization approved by the board and shall be done at the expense of the applicant. Such evaluation may be waived if the applicant has received a graduate degree from a United States institution which has a bachelor's degree program accredited by EAC/ABET in the discipline of the applicant's graduate degree and, in the judgment of the board, has completed the equivalent of an EAC/ABET undergraduate program.
A photograph of the applicant shall appear in the space provided upon the application form. It shall be an unretouched photograph taken within six months of the date of application, and the face shall be portrayed not less than three-fourths inch in width.
Last updated September 11, 2023 at 1:26 PM